Specification :

9, 10-dihydro-9-oxa-10-phosphahenanthrene-10-oxide
Abbreviation: DOPO
CAS NO: 35948-25-5
Chemical Formula: C12H9O2P

Specification:
Appearance White crystal or powder
purity e99 %
content e14.0%
Melting point e116oC

Application: DOPO contains a rigid phosphorus group and thus provide better thermal and flame-retardant properties than the conventional epoxy resins prepared from tetrabromobisphenol A. The advanced epoxy resins are suitable for making a fiber-reinforced epoxy resin composite which is useful in the fabrication of printed circuit boards. The cured epoxy resins can be used in semiconductor encapsulation applications.