laser wafer sawing system

Quantity Order:

Origin:

China

Payment Method:

Bank Cheque

1. High speed scribing, efficient, low defective index.

2. No contact procession, no mechanical stress, improve quality.

3. CCD quick location function, synchronic and coaxial control function.

4. High precision 2D linear movement and DD rotary worktable.

5. Marble base, stable, low heat distortion.

6. Precision numerical control system.

7. Chinease operation interface, easy, simple and friendly.

8. Scribing technical export system.

9. High reliability and stability.

Widely used for scribing and cutting of integrated circuit wafer, GPP diode wafer, GPP silicon controlled wafer and OJ wafer.

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