Specification :

Characteristic:
A) Good resistance to rebound to prevent the U face part of the tilt,
it is the best adhesive products for LED lamp.Bonded quickly
and easy,better than the common thermal conductivity products.
B) Strong adhesion for the IC aluminum heat sink, Also applies to
a variety of body (copper, iron, PC, PP board, polystyrene
board, ABS board, etc).
C£©Good scalability, stable adhesiveness and efficient cooling,
make the product reach the best effect , and also improve
the product life.
Product Application:
1.£©For the CPU, ASIC, and thermal bonding Card
2.£©BGA thermal plate assembly
3.£©IC, LED, the bonding of metal heat sink
4.£©Bonding flexible circuits and rigid thermal conductivity board.
5.£©Computer memory, controller, power adapter
6£©TFT-LCD,LCD,P/S
7.) LED displays, LED fluorescent lights that require cooling of
electronics components