Specification :

Ceramic DPC/ DBC
Materials: Al2O3, AlN
Coating matel and circuit diagram for any drawing
Metal: any such as Cu, Ni, Au....

Ceramic metallized: Ti/ W, gold( Au) , sliver( Ag) , Copper( Cu) , nickel( Ni) others & produce final circuit
coating: 0.03um to 5mil
Ceramic Metallized substrate:
Al2O3 substrate metallized
AlN substrate metallized
Silicon wafer metallized
LED heat-dissipation ceramic substrate:
LED Al2O3 thin film substrate
LED Al2O3 thick film substrate
LED AlN thin film heat-dissipation substrate
Flip chip substrate:
The integration of the thin film, thick film, electrode plating and electroless plating processes:
Application:
1. High Power LED ceramic substrate
2. Microwave ( Wireless Communication & Radar)
3. Semiconductor Process Equipment
4. Solar Cell
5. Hybrid Electric Vehicles
6.Flip chip/ eutectic substrate
7.Sensor ceramic substrate