Specification :

Direct Copper Bonded/ DBCu Substrates
Excellent electrical insulation
Very good thermal conductivity
Superb thermal cycling

Direct Copper Bonded/ DBCu Substrates
Features
· Fine Mechanical strength
· Fine Adhesion and Corrosion Resistent
· Excellent Electrical Insulation and Thermal Conductive Properties
· High Reliability
· Lower Thermal Expansion Coefficient
· Etchable to Various Graphs

Applications
Power Semiconductor Modules
· Power Hybrids
· Power Control Circuits
· Solid-state Relays
· Semiconductor Refrigerators
· Electronic Devices for Automobile
· Intelligent Power Assemblies
· Solar Cell Board